What Is Co-Packaged Optics? Why Scalable CPO Must Be Built as a System | Corning

Here's how CPO scales when the path from faceplate to silicon is engineered end-to-end.

Benoit Fleury
Published: July 23, 2026

For most of the last decade, AI infrastructure teams have grown network capacity along familiar axes: scaling up compute nodes, scaling out GPU clusters to more racks, and scaling across regions through interconnected data centers. But there’s a more fundamental shift happening. The optical network is now expanding deeper inside the data center by moving optics inside the box. Technologies like Co-Packaged Optics (CPO) and Near Package Optics (NPO) push fiber past the front plate, terminating it within millimeters of the silicon to achieve major gains in power, density, and reliability.

Optical networks that used to run box-to-box now run chip-to-chip. That single architectural shift is reshaping how next-generation AI switches are built, engineered from front plate to chip as one cohesive system.

Key Takeaways

Why AI networks need fiber-to-chip connectivity

In a traditional data center architecture, optical fiber connects switches to each other, but that fiber only goes to the faceplate. A pluggable transceiver on the front of the box converts the optical signal to an electrical one, and data travels across roughly a foot of copper traces before reaching the chip. That distance may not sound like much, but at the speeds modern AI workloads demand, it becomes a real problem.

What's the issue with the current setup? Power consumption climbs sharply because compensating for a noisy electrical channel over that distance takes heavy digital signal processing (DSP) work. Signal integrity degrades, crosstalk increases, and you eventually run out of usable PCB area for high-speed traces.

CPO addresses most of those issues at once by treating the signal path as one optimized system instead of a chain of independent parts. The transceiver function still exists. Light still has to be converted to an electrical signal. But with CPO and NPO, the result is better power efficiency, lower latency, higher density, and greater reliability. A unified system design brings major benefits, but it is also a key challenge we’ve worked to simplify.

The real complexity is inside the box

 A single CPO assembly can route well over 1,000 fibers in tight internal volumes, each landing on a photonic integrated circuit (PIC) within sub-micron alignment tolerances. Getting that right at hyperscale volumes means balancing four requirements that affect each other:

  1. Performance, including minimized insertion loss
  2. Density, or the number of fibers that can fit within a limited space
  3. Reliability under operational stress
  4. Ease of assembly at manufacturing scale
     

These four aspects pull against each other in practice. Every choice made to hit one target affects the others. The trade-offs are only resolved when the front plate connector, specialty optical fiber, and fiber array units are designed and managed together against the same target.

Why integration improves reliability

Because this is a highly integrated system, parts inside the box are generally not field-replaceable or serviceable. That may sound like a drawback until you look at the reliability data. Publicly reported testing of CPO switch platforms has demonstrated the potential for highly reliable operation over extended link-hour testing. One such test demonstrated one million link hours without a single link flap. Link flaps are brief connectivity disruptions and one of the most closely watched reliability metrics in high-performance data center networks. That result is achievable when the entire optical path is treated as one engineered link, not a chain of independently sourced components. 

Reliability has long been the subject of research at Corning. A white paper produced by Corning and Broadcom explores the design and handling practices developed over decades to ensure high reliability when using optical fibers, with a specific focus on emerging CPO designs.

How Corning enables CPO at scale

Corning's deep understanding of materials science and passion for innovation have positioned the company to support photonic technologies such as CPO and NPO. We design and manufacture every passive element along the internal optical path: front plate connectors built for density, specialty fiber engineered for tight-bend internal routing, pre-assembled and pre-tested optical trays, and high-precision detachable fiber array units at the chip end. When you combine that expertise into one integrated solution, you get our Optical Management Solution (OMS). It’s an all-in-one system that balances and packages high-speed connectivity, tightly routed and managed CPO fiber, and precision FAU harnesses into a single unit.  It’s designed around the customer's chassis and tested end to end. This solution makes installation dramatically easier by pre-assembling every optical component before it ships. The customer sources power, cooling, and an ASIC from their foundry of choice. Corning provides the optical components between the front plate and the chip, already organized, qualified, and ready to install.

The takeaway

CPO is still in its early days. The concept dates back decades to high-performance computing, but the conditions for data center deployment are only now ripe, and the next few years will bring fast innovation in fiber, FAU, and connector density. The teams that win that next phase won't be the ones with the best individual component. They'll be the ones who treat the path from front plate to chip as a single engineered system, owned end to end.

Benoit Fleury

Benoit Fleury is PCS Business Director at Corning Optical Communications. Prior to this he led the OEM business including the micro-optics product team. Before joining Corning, Benoit led the Product Line Management team at iBwave, an indoor RF planning software company which Corning acquired in 2015. Earlier on in his career Benoit drove product growth in other telecom companies including Nortel and EXFO, and developed Lynx Mobility, a cellular infrastructure & service company in northern Canada which he led as its initial President & CEO. Benoit holds a Master’s Degree in Electrical Engineering from Concordia University in Montreal, is a Senior IEEE member and judges annually at Concordia’s John Molson School of Business’ international MBA case competition. Outside professional engagements, he’s an avid sailing and motorcycling enthusiast.

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