What is Co-Packaged Optics (CPO) Technology? | Corning

Today, data centers use a separate approach for optics and electronics, in which optical modules are connected to switches and routers through high-speed electrical interfaces. As data demands grow, these systems face limitations such as bandwidth constraints, latency issues, and space limitations due to bulky cables.

CPO revolutionizes data center design by integrating optics and electronics, leading to improvements in power efficiency and bandwidth density. As applications like AI and machine learning become more prevalent, demanding higher bandwidth data processing capabilities, CPO technology provides a scalable solution that can grow with these needs.

Corning is taking part in the co-packaged optics revolution with our innovative fiber and optical connectivity products along with a team of subject matter experts.

Check out our webinar, in which industry experts from Corning and Broadcom explore key design considerations, fiber handling practices, and effective deployment strategies for navigating the emerging field of co-packaged optics. Watch Our Webinar Now >

Co-Packaged Optics (CPO) is a technology and design approach where optical components, such as lasers and photodetectors, are integrated alongside electrical components, like Application-Specific Integrated Circuits (ASICs), within the same package. This integration significantly reduces the physical distance between the optical and electrical components, thereby increasing bandwidth and enhancing performance.

1. Power Consumption: By placing optical and electronic components close together, CPO reduces energy loss and lowers power requirements compared to traditional setups.

• One of the largest expenses for data centers is their energy bill. By reducing power usage, they can significantly lower these costs. Additionally, reducing power consumption optimizes cost, performance, and sustainability in data center operations.

2. Bandwidth: CPO supports higher data rates by integrating optics with electronics, enhancing throughput for next-gen data centers.

3. Performance: Direct integration with ASICs enhances signal integrity, reduces latency, and minimizes insertion loss, crucial for fast data transfer.

4. Scalability: CPO enables data centers to connect multiple nodes at high bandwidths, supporting increased data processing and storage demands.

5. System Design: CPO considers both optical and electrical elements in design, optimizing performance, reliability, and manufacturability.