What is Co-Packaged Optics (CPO) Technology? | Corning

Co-Packaged Optics (CPO) Solutions

Co-Packaged Optics (CPO) Solutions

Today, data centers use a separate approach for optics and electronics, in which optical modules are connected to switches and routers through high-speed electrical interfaces. As data demands grow, these systems face limitations such as bandwidth constraints, latency issues, and space limitations due to bulky cables.

CPO revolutionizes data center design by integrating optics and electronics, leading to improvements in power efficiency and bandwidth density. As applications like AI and machine learning become more prevalent, demanding higher bandwidth data processing capabilities, CPO technology provides a scalable solution that can grow with these needs.

Corning is taking part in the co-packaged optics revolution with our innovative fiber and optical connectivity products along with a team of subject matter experts.

Check out our webinar, Scalable Fiber Solutions for Co-Packaged Optics (CPO) Applications, in which industry experts from Corning and Broadcom explore key design considerations, fiber handling practices, and effective deployment strategies for navigating the emerging field of co-packaged optics. Watch Our Webinar Now >

What is Co-Packaged Optics?

What is Co-Packaged Optics?

Co-Packaged Optics (CPO) is a technology and design approach where optical components, such as lasers and photodetectors, are integrated alongside electrical components, like Application-Specific Integrated Circuits (ASICs), within the same package. This integration significantly reduces the physical distance between the optical and electrical components, thereby increasing bandwidth and enhancing performance.

The Future of Data Center Connectivity

What are the Benefits of Co-Packaged Optics?

What are the Benefits of Co-Packaged Optics?

1. Power Consumption: By placing optical and electronic components close together, CPO technology reduces energy loss and lowers power requirements compared to traditional setups.

• One of the largest expenses for data centers is their energy bill. By reducing power usage, they can significantly lower these costs. Additionally, reducing power consumption optimizes cost, performance, and sustainability in data center operations.

2. Bandwidth: CPO technology supports higher data rates by integrating optics with electronics, enhancing throughput for next-gen data centers.

3. Performance: Direct integration with ASICs enhances signal integrity, reduces latency, and minimizes insertion loss, crucial for fast data transfer.

4. Scalability: CPO technology enables data centers to connect multiple nodes at high bandwidths, supporting increased data processing and storage demands.

5. System Design: CPO technology considers both optical and electrical elements in design, optimizing performance, reliability, and manufacturability.

Corning and Broadcom Present: Deploying Robust and Scalable Co-Packaged Optics Fiber Infrastructure

Corning and Broadcom Present: Deploying Robust and Scalable Co-Packaged Optics Fiber Infrastructure

Corning and Broadcom's white paper offers insights into co-packaged optics (CPO), examining its impact on high-bandwidth switches and distributed-computing hardware in data centers. It addresses design practices, reliability challenges, and provides guidance for engineers adapting to CPO infrastructure. Download it for a deeper understanding of maintaining reliability in CPO designs.

Download the White Paper >

co-packaged optics

What is Co-Packaged Optics?

Learn how co-packaged optics is reshaping networks by slashing power use and unlocking massive bandwidth for next-gen AI performance.

Learn how co-packaged optics...

Learn how co-packaged optics is reshaping...

Learn how co-packaged optics is reshaping networks by slashing power use...

Learn how co-packaged optics is reshaping networks by slashing power use and unlocking massive bandwidth for...

Learn how co-packaged optics is reshaping networks by slashing power use and unlocking massive bandwidth for next-gen AI performance.

Co-Packaged Optics FAQs

  • What is CPO technology?

    Co‑packaged optics (CPO) is an advanced architecture that brings fiber directly to the chip by integrating optical engines alongside switch ASICs or GPUs. Instead of relying on traditional pluggable optics, CPO uses tightly integrated optical and electrical components within the same package to couple light into and out of the chip.

  • Why is CPO necessary for AI and hyperscale data centers?

    AI and hyperscale environments demand massive bandwidth, lower latency, and improved power efficiency—limits that traditional copper and pluggable optics struggle to meet. CPO enables high‑density fiber routing, reduced power consumption, and scalable optical I/O, making it ideal for next‑generation AI clusters.

  • How does fiber management work in CPO systems?

    CPO systems rely on a structured fiber management system that connects FAU harnesses and fiber management cassettes into a unified architecture. An optical management system organizes fiber routing, protects high‑density connections, and ensures scalability and serviceability, transforming precision components into a deployable system.

  • What is Corning’s relationship with NVIDIA and how does Corning contribute to their CPO technology?

    Corning and NVIDIA are working together to advance AI connectivity by collaborating on co-packaged optics –bringing optics inside the box. 

    Our multiyear commercial and technology partnership, announced in May 2026, will dramatically expand U.S.-based manufacturing of the advanced optical connectivity solutions needed to power next-generation AI infrastructure. As part of this agreement, Corning will increase its U.S. fiber production capacity by 50%. This expanded capacity will supply the optical connectivity hyperscale data centers use to deploy NVIDIA-accelerated computing at scale.

     In 2025, NVIDIA announced that Corning is one of its technology innovation partners for its silicon photonics ecosystem, which enables AI factories to link GPUs while saving energy and operational expenses. As part of our collaboration, Corning solutions are compatible with NVIDIA’s Quantum-X Photonics and Spectrum-X Photonics networking switches.

Co-Packaged Optics Featured Products and Innovations:​

GlassBridge™ Fiber-to-PIC Connector Technology

GlassBridge™ Fiber-to-PIC Connector Technology

A complete connector assembly for modern optical systems that enables high‑density, scalable fiber‑to‑PIC connectivity without sacrificing reliability.

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Fiber Array Units

Fiber Array Units

Our latest innovation in our range of Fiber Array Units empower your high-density and low-loss applications.

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Very Small Form Factor Connectors (VSFF) - ​ MMC Connector​

Very Small Form Factor Connectors (VSFF) - ​ MMC Connector​

The MMC Connector is a compact connector (16F and 24F) designed to help data centers quickly expand to accommodate high-bandwidth AI applications.

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CPO Optimized Fiber-CPO FlexConnect

CPO Optimized Fiber-CPO FlexConnect™

Corning CPO FlexConnect™ fiber is the ideal solution for optical and mechanical designers seeking to address bend and MPI challenges in short-length, co-packaged optics within the O-band.

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