Corning fiber array units (FAUs) are engineered for long‑haul, metro, and data center applications, delivering ultra‑precise fiber alignment with low insertion loss and high optical return loss. Leveraging specialty fibers, customizable V‑groove designs, and advanced dicing and metrology, Corning FAUs are tailored to customer requirements including core pitch, channel count, fiber type, and termination method.
Fiber Array Units (FAUs) for Optical Networks and Advanced Photonics
Fiber Array Units (FAUs) for Optical Networks and Advanced Photonics
Proven Expertise and Performance
- Reliability and flexibility: High reliability in harsh environments, compact design, flexibility in fiber selection, and customizable termination methods.
- Trusted innovation leader: Corning’s expertise in materials science ensures cutting-edge solutions and reliable performance.
- Advanced technology and integration: Incorporates specialty fiber capabilities, customizable V-groove chips, and FAU-integrated connectors/interposers for evolving PIC requirements.
- Customizable and precise solutions: Tailored to unique specifications with ultra-accurate fiber core position, low insertion loss, and high optical return loss.
- Versatile applications: FAUs designed for long-haul, metro networks, data centers, and advanced optical solutions like AWGs, OADMs, switches, V-muxes, and Silicon Photonics (SiP) assemblies.
Built on Corning’s leadership in materials science, FAUs can also be developed as integrated connectors or interposers to support evolving photonic integrated circuit (PIC) architectures.
Evolving FAUs for Next-Generation Connectivity
Evolving FAUs for Next-Generation Connectivity
As photonics moves closer to compute, FAUs play a critical role in enabling precise, low‑loss fiber‑to‑chip connectivity. Corning FAUs support advanced silicon photonics and Co‑packaged Optics (CPO), helping customers scale bandwidth density while maintaining manufacturability and reliability.
Photonic-Grade FAUs for Advanced Photonics
For the most demanding fiber‑to‑chip applications, Corning offers a photonic-grade FAU engineered for exceptional precision and ultra‑low optical loss. Built with advanced photonic‑grade fiber and enhanced core pitch control, it is ideally suited for silicon photonics, co‑packaged optics (CPO), and ultra‑high‑performance computing.
Coupling Flexibility for CPO and Silicon Photonics
Corning FAUs support multiple fiber‑to‑chip coupling approaches to align with current and future photonic platforms:
- Edge‑Coupled FAUs
Designed for today’s high‑performance photonic systems, routing light through the edge of the PIC. - Vertically Coupled FAUs
Enable surface‑based coupling architectures to support higher density, advanced packaging, and next‑generation CPO designs.
Precision manufacturing and alignment ensure consistent optical performance across both approaches.
Advanced FAU Assemblies for System‑Level Integration
Corning develops advanced FAU assemblies that integrate precision alignment features, micro‑optics, and detachable interfaces to simplify system‑level design and assembly for CPO and fiber‑to‑PIC applications.
Products
FAQs
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What is a Fiber Array Unit (FAU)?
A Fiber Array Unit (FAU) is a passive optical component that precisely aligns multiple optical fibers to optical devices or assemblies. Corning FAUs deliver ultra‑accurate fiber core positioning with low insertion loss and high optical return loss to support reliable performance in optical networks and advanced photonic systems.
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What customization options are available for Corning Fiber Array Units?
Corning FAUs are highly customizable to meet application‑specific requirements, including core pitch, channel count, fiber type, V‑groove design, and termination method. This flexibility allows FAUs to be tailored for a wide range of optical architectures without compromising precision or manufacturability.
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Are Corning FAUs compatible with Silicon Photonics (SiPh) and Co-Packaged Optics (CPO)?
Yes. Corning FAUs are used in Silicon Photonics assemblies and support the precision alignment required for fiber‑to‑chip connectivity. Corning also develops FAU‑integrated connectors and interposers to support evolving architectures, including Co‑Packaged Optics.
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What is the difference between Edge and Vertical Coupling?
Edge coupling aligns optical fibers to the edge of a photonic integrated circuit, while vertical coupling aligns fibers perpendicular to the chip surface. Both approaches require extremely precise fiber positioning, and Corning FAUs can be designed to support either coupling method depending on system architecture and design requirements.
