Co-packaged optics (CPO), by merging optics and electronics, brings about a revolution in data center design, significantly enhancing power efficiency and bandwidth density. As the demand for higher bandwidth data processing capabilities increases with the rise of applications such as AI and machine learning, CPO technology offers a scalable solution that can adapt to these evolving needs. Learn more about co-packaged optics here.
Corning and Broadcom have collaborated to develop this white paper, which delves into insights and expertise, with a specific focus on the emerging field of co-packaged optics. The revolutionary CPO technology is reshaping high-bandwidth switches and distributed-computing hardware in data centers. The paper explores the design and handling practices developed over decades to ensure high reliability when using optical fibers, with a specific focus on emerging CPO designs. It also discusses challenges that manufacturers may face in adapting to this new infrastructure, particularly in terms of reliability and deployment. Download the whitepaper today to gain a deeper knowledge to navigate the complexities of CPO and harness its potential in your data center architecture.