Semiconductor Glass Wafers | Semiconductor Packaging | Corning

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New requirements are emerging in electronics packaging. RF components need to support higher frequency bands, fan-out technology is being leveraged as an effective way to address interconnect challenges and the emergence of IoT will drive the needs for trillions of tiny sensors. Simultaneously, there is continuous search for more cost-effective solutions to difficult packaging challenges. 

Corning semiconductor glass wafers can help address these challenges. 

Corning's Semiconductor Glass Substrates

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