Propelling AI Connectivity with Co-Packaged Optics Collaboration | Corning and NVIDIA | Corning

Corning and NVIDIA to Propel AI Connectivity with Co-Packaged Optics Collaboration

Sean Kelly
Published: March 18, 2025

Corning was thrilled to be a part of the GTC AI Conference (March 2025). This event provides an unparalleled opportunity to showcase groundbreaking innovations and celebrate the partnerships that drive technological progress. It brings thousands of developers, innovators, and business leaders to experience real-world examples of AI and its benefits.

Corning is one of NVIDIA’S technology innovation partners for its silicon photonics ecosystem, which enables AI factories to link GPUs while saving energy and operational expenses.

I’d like to share our perspective on this exciting collaboration.

Our Collaboration with NVIDIA

The journey to GTC 2025 has been marked by a series of collaborative efforts and mutual support between Corning and NVIDIA.

Corning and NVIDIA see a promising future for Co-Packaged Optics (CPO) in artificial intelligence networks. This form of connectivity enables power consumption efficiency and lower latency data processing by extending the fiber connection right to the photonic chips inside the equipment – empowering networks to make faster computations for next generation AI capabilities.

As part of our collaboration, Corning solutions are compatible with the new line of NVIDIA Quantum-X Photonics and Spectrum-X Photonics switches incorporating CPO — a significant technological effort to meet the future bandwidth needs of AI systems.

There has also been a dynamic evolution of high-density connectivity required to interconnect these devices within the data center environment which has introduced new complexities. Corning addresses these challenges with a suite of advanced solutions, including high-density rack optical cabling solutions and shuffle devices for port breakout and rail optimization. These innovations feature high fiber count with low outer diameter cables that are factory terminated with MMC connectors and optimized for next-generation GPU configurations.

As the industry leader in fiber innovation, Corning is excited to work with NVIDIA to advance AI networks, the industries it transforms, and the lives it improves.

For detailed information on Corning's new fiber, connectivity, and cable solutions, please refer to the Corning cabling guide for NVIDIA referenced architectures.

Sean Kelly

Sean Kelly, Vice President & Business Director, Data Center Business Unit. Sean leads commercial, product, manufacturing, supply chain, and innovation delivery efforts in support of Corning Optical Communications’ global Data Center initiative to capture AI-driven data center growth. Kelly joined Corning in 2000 as an Enterprise Sales Engineer in Northern California. His robust past experience within Corning Optical Communications includes a series of leadership roles in sales, product line management, and FTTX portfolio, as well as managing the Optical Connectivity Solutions portfolio. Prior to his current role, he was responsible for AT&T and Canadian Carriers. Kelly is also the chairman of the board of directors of US Conec.

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