Process Solution for Glass Wafer Dicing
For over 170 years, Corning has applied its unparalleled expertise in glass science, ceramic science, and optical physics. Now, Corning Laser Technologies (CLT) is leveraging 20-plus years of experience in precision laser machining with Dynatex International’s 60 years expertise in die singulation.
The CLT 400S-WD has been developed to provide a new laser dicing solution for the Semiconductor industry with a compact footprint and high precision stages. By uniting the innovative laser process with the StreetSmart breaking technology, we offer an industry-leading Glass-Wafer Dicing Solution to yield superior throughput, enable unprecedented aspect ratios and a die quality that meets highest demands.
This industry-leading dicing solution is capable of handling up to 300mm wafer and 400mm panels. The design of the base tool is modular and prepared for custom automation.