Process Solution for Glass Wafer Dicing
The CLT 400S-WD has been developed to provide a new laser dicing solution for the Semiconductor industry with a compact footprint and high precision stages. By uniting the innovative laser process with the Street-Smart breaking technology, we offer an industry-leading Glass Wafer Dicing Solution to yield superior throughput, enable unprecedented aspect ratios and a die quality that meets highest demands.
This industry-leading dicing solution is capable of handling up to 300mm wafer and 400mm panels. The design of the base tool is modular and prepared for custom automation.