Laser Cutting and Drilling of Glass and Brittle Materials
Laser Cutting and Drilling of Glass/Materials
Laser Processing and Automation for Micro Materials
Corning Laser Technologies is on the forefront of laser innovation, offering laser systems that have a distinct advantage over conventional glass cutting processes. Corning offers laser glass processing systems with the ability to cut Corning® Gorilla® Glass, chemically strengthened glass as well as un-strengthened glass and other brittle materials.
The flexible machine platforms serve a wide range of emerging applications, which require precise and flexible glass processing technologies. Designed for substrate sizes up to an edge length of 2.5m, combined with the best beam delivery technology from fixed optics via scanner systems to flying optics, enables flexible adaption to individual customer requirements.
In-house process development and tailored solutions for full automation, round out the product portfolio, providing a one-stop-shopping at Corning.
Corning’s laser processing systems are designed for continuous operation and combine +20 years of experience in laser precision machining with Corning’s unique material science knowledge.
Advanced Laser Process
Conventional laser cutting is based on rapid heating processes, leading to vaporization and material removal. This method tends to create micro-cracks, chip-outs and a rough surface finish, which makes time consuming and costly subsequent grinding and polishing steps necessary, leading to low production yields.
Using specially tuned lasers to cut glass by disassociation rather than ablation, the Corning laser glass cutting technology provides numerous benefits:
Smooth Edges – The ‘as-cut’ edge roughness may significantly reduce or in some cases even eliminate post-processing and thus process time and cost.
High Break Strength – The ‘as-cut’ edge demonstrates superior break strength over other laser and conventional cutting processes as measured by 4 point bend tests.
Multi-Layer Stacks – The systems enable cutting of assembled functional multi-layer stacks with and without air gaps, where cutting depths can be adjusted.
Unique Benefits
- Free-form, near net-shape cutting
- Cuts: curved, straight, perpendicular and angled lines as well as holes and slots
- Cuts up to 1 m/s to maximize throughput
- Reliably reduces edge defects such as micro-cracks
- Pristine edge quality
- Minimal material loss
- Minimal particle generation
- Minimal surface roughness and SSD
- Cuts functional multi-layer stacks
- Cuts glass from <50µm up to 4 mm thickness
- Automatic/touch-free separaton process on many materials
- Reduces the need for post processing such as grinding and polishing
- Eliminates fluids and tooling required in traditional processing methods
Laser Technologies
Laser Cutting Display and Strengthened Glass and Glass Substrates
Laser Cutting Display and Strengthened Glass and Glass Substrates
Corning Laser Technologies' laser cutting processes employ ultra-short laser pulses in the picosecond range that cut glass, utilizing nonlinear processes. This ensures a low as cut edge roughness, increased cut bend strength, and a higher throughput. Corning’s laser glass cutting thus enables superb as cut quality, maximum output and yield in high volume production of touchscreen displays for smart phones, tablet PCs and other consumer products.
With an as cut edge roughness at < 2µm, in most cases the cut glass can be used for subsequent processing without additional intermediate steps for time and cost consuming post-processing. Glass pieces cut with Corning Laser Technologies' unique laser glass cutting process have superior break strength behavior, compared to items cut by other laser methods and conventional mechanical glass cutting processes.
Corning Laser Technologies' laser cutting processes employ ultra-short laser pulses in the picosecond range that cut glass, utilizing nonlinear processes. This ensures a low as cut edge roughness, increased cut bend strength, and a higher throughput. Corning’s laser glass cutting thus enables superb as cut quality, maximum output and yield in high volume production of touchscreen displays for smart phones, tablet PCs and other consumer products.
With an as cut edge roughness at < 2µm, in most cases the cut glass can be used for subsequent processing without additional intermediate steps for time and cost consuming post-processing. Glass pieces cut with Corning Laser Technologies' unique laser glass cutting process have superior break strength behavior, compared to items cut by other laser methods and conventional mechanical glass cutting processes.
Corning Laser Technologies offers unique laser processing for demanding applications such as laser cutting of cover glasses for mobile phones, tablet PCs, camera protection glasses, automotive glass, semiconductor glass and coated substrates.
A specially tuned laser is used to perforate brittle material using a nonlinear optical process. The technology can be used to cut Corning Gorilla Glass, chemically strengthened and un-strengthened glass as well as a wide range of other brittle materials.
Laser Drilling Glass
Laser Drilling Glass
Our drilling processes employ ultra-short laser pulses (in the picosecond range) that remove glass through nonlinear effects. The technology can be used to drill glass with extremely low wall taper and little to no micro cracks. Beyond drilling, any geometry can be cut, including cut-outs such as circles or slots, closed-form and radius form factors.
Drilling of Brittle Materials
Corning Laser Technologies' laser drilling works for both unstrengthened and strengthened glass, as well as other brittle materials. The process is clean room compatible, because it generates close to zero material loss and debris.
Corning Laser Technologies’ drilling processes employ ultra-short laser pulses (in the nanosecond and picosecond range) that remove glass through nonlinear effects or ablation. The technology can be used to drill glass with extremely low wall taper and very little to no micro cracks. Beyond drilling, any geometry can be cut, including cut-outs such as circles or slots, closed-form and radius form factors.
Laser Drilling of Brittle Materials
Corning Laser Technologies' laser drilling works for both un-strengthened and strengthened glass, as well as other brittle materials. The process is clean room compatible, due to generating close to zero material loss and debris.
We Can Fit Your Needs
We Can Fit Your Needs
Corning Laser Technologies (CLT) is at the forefront of laser innovation, offering laser processing systems that have a distinct advantage over conventional glass cutting processes. CLT offers laser glass processing systems with the ability to cut Corning Gorilla Glass, chemically strengthened glass as well as un-strengthened glass and other brittle materials.
The flexible machine platforms are serving a wide range of emerging applications, which require precise and flexible glass processing technologies. Freedom to work substrate sizes up to an edge length of 2.5m, combined with the best available technology for beam delivery from fix optics via scanner systems to flying optics, enabling a flexible adaption to individual customer requirements.
In-house process development and tailored solutions for full automation, round off the product portfolio, providing a one-stop-shopping at Corning.
Corning’s laser processing systems are designed for continuous operation and combine +20 years of experience in laser precision machining with Corning’s unique material science knowledge.
Corning offers well-equipped laboratories in Germany, US and Asia, comprising of production like equipment, set up with a wide range of laser sources at different wavelengths and sophisticated state of the art optical, electrical and mechanical metrology tools.
Experienced applications engineers are developing individual laser process solutions in close collaboration with YOU.
Corning offers advanced laser machining systems for glass processing of both strengthened and unstrengthened glass as well as other brittle materials. Our application lab located in Germany can help tailor a solution to your requirements.
Cutting of Glass Substrates
- Display glass
- Coated substrates
- Sandwich applications
- Cutting thin substrates
Separation of Strengthened Glass
- Cover glass for mobile phones
- Cover glass for tablets and PCs
- Camera protection glass
Drilling in Glass Substrates
- Mobile device (camera aperture, home button, speaker etc.)
Laser Cutting Systems
CLT 500X
CLT 500X
The CLT 500X is a laser processing workstation designed for high-precision applications in the glass, precision engineering, and electronics industries.
The CLT 500X is a laser processing workstation designed for high-precision applications in the glass, precision engineering, and electronics industries.
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CLT 45G NX
CLT 45G NX
The CLT 45G NX laser system is specifically designed for cutting and drilling strengthened and nonstrengthened glass and other crystalline materials, as well as processing micro materials.
The CLT 45G NX laser system is specifically designed for cutting and drilling strengthened and nonstrengthened glass and other crystalline materials, as well as processing micro materials.
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CLT 60G
CLT 60G
The CLT 60G is designed for cutting and drilling strengthened glass and other brittle materials. The CLT 60G platform is a dedicated production machine for up to GEN 6 size.
The CLT 60G is designed for cutting and drilling strengthened glass and other brittle materials. The CLT 60G platform is a dedicated production machine for up to GEN 6 size.
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CLT 80G
CLT 80G
The CLT 80G laser glass processing tool is designed for 24/7 manufacturing in an industrial environment, supporting a glass substrate size of up to 2300 mm x 2500 mm.
The CLT 80G laser glass processing tool is designed for 24/7 manufacturing in an industrial environment, supporting a glass substrate size of up to 2300 mm x 2500 mm.
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