CORNING, N.Y —Corning Incorporated (NYSE: GLW) and US Conec announced today a collaboration to deploy MDC connector solutions that help increase density for hyperscale data centers, carrier distribution networks and other high-density patching applications.
US Conec’s MDC connector, a specified optical connector interface in both the QSFP-DD and the SFP-DD transceiver MSAs, provides three times the density over LC connectors, while still providing high optical connector performance via industry standard 1.25mm ferrules. In addition, the companies are announcing an agreement enabling both parties to produce the MDC connector components for assurance of supply.
The MDC connector was designed for breakout application in QSFP-DD, SFP-DD, and OSFP optical transceivers, as well as to challenge the “status quo” for patch panel density. Various features implemented in the connector, including simple insertion/extraction using a built-in push/pull boot and simple field-polarity configurability for UPC and APC variants, ensure the MDC platform provides operators with future-ready capacity in a smaller footprint with easier installation.
“This very small form factor MDC connector enables high-density direct transceiver breakout applications while also enabling three times more patch panel density in structured cabling applications,” said Brian Rhoney, director of Market Development, Corning Optical Communications. “This connector is versatile for a variety of market applications due to its compliance with traditional Telcordia requirements, along with unique features like intuitive push-pull boot and field polarity reversal. Corning is eager to leverage this connector to innovate new solutions which address current market challenges.”
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About Corning Incorporated
Corning (www.corning.com) is one of the world's leading innovators in materials science, with a more than 165-year track record of life-changing inventions. Corning applies its unparalleled expertise in glass science, ceramic science, and optical physics along with its deep manufacturing and engineering capabilities to develop category-defining products that transform industries and enhance people's lives. Corning succeeds through sustained investment in RD&E, a unique combination of material and process innovation, and deep, trust-based relationships with customers who are global leaders in their industries.
Corning's capabilities are versatile and synergistic, which allows the company to evolve to meet changing market needs, while also helping our customers capture new opportunities in dynamic industries. Today, Corning's markets include optical communications, mobile consumer electronics, display technology, automotive, and life sciences vessels. Corning's industry-leading products include damage-resistant cover glass for mobile devices; precision glass for advanced displays; optical fiber, wireless technologies, and connectivity solutions for state-of-the-art communications networks; trusted products to accelerate drug discovery and delivery; and clean-air technologies for cars and trucks.
About US Conec
US Conec (www.usconec.com) is a global leader in the design and development of high-density optical interconnects. With nearly 30 years of innovative experience, the company provides industry leading components for data center and enterprise structured cabling, public networks, on-board optical interconnects, industrial and military markets worldwide. Key product developments include single-mode and multimode MT-style and custom multi-fiber ferrules, MTP® brand MPO connectors, MXC® connectors, PRIZM® LightTurn® and PRIZM® MT lensed ferrule technology, ELiMENT™ single fiber connector solutions, IBC™ brand fiber optic cleaning solutions, termination equipment for multi-fiber interconnects, and high precision optical packaging components. US Conec is headquartered in Hickory, North Carolina, and is an equity venture of three leading communication technology companies—Corning Optical Communications, Fujikura, and NTT-AT.