Corning Precision Glass Solutions Introduces Advanced Packaging Carriers Optimized for Fan-Out Processes

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Precision Glass Solutions Introduces Advanced Packaging Carriers Optimized for Fan-Out Processes

Advanced Optics
Corning Precision Glass Solutions Introduces Advanced Packaging Carriers Optimized for Fan-Out Processes
Corning, N.Y. | Corning Incorporated | January 21, 2019

CORNING, N.Y. — Corning Incorporated (NYSE: GLW) today introduced its latest breakthrough in glass substrates for the semiconductor industry – Advanced Packaging Carriers. This enhanced line of glass carrier wafers is optimized for fan-out processes, a type of cutting-edge semiconductor packaging that enables smaller, faster chips for consumer electronics, automobiles, and other connected devices.

Corning Advanced Packaging Carriers feature three significant improvements:

    - Fine granularity in a wide range of available coefficients of thermal expansion (CTE)
    - High stiffness composition
    - Rapid sampling availability

These attributes are important for customers pursuing fan-out packaging because:

    - Fine granularity enables customers to more easily select the optimal CTE needed to minimize in-process warp.           Precise CTE offerings thereby help reduce customers’ development cycle time.
    - Corning’s high stiffness compositions help further reduce in-process warp. Minimizing warp helps maximize                their yield of packaged chips.
    - Rapid sampling availability also contributes to reduced development time and enables customers to move to the         mass production phase more quickly.

“We created Corning Advanced Packaging Carriers especially for our customers pursuing the most challenging types of chip manufacturing processes,” said Rustom Desai, commercial director of Corning Precision Glass Solutions.

“Our deep technical ties in the semiconductor industry, combined with Corning’s core competencies in glass science and manufacturing, enabled us to create an innovative product that can help customers maximize efficiency throughout their development process and mass production ramp,” Desai said.

Corning’s semiconductor glass carriers are one of several products in Corning’s portfolio of Precision Glass Solutions designed to address the emerging need for glass across microelectronics. This portfolio provides customers with a one-stop shop for world-class capabilities including proprietary glass and ceramic manufacturing platforms, finishing processes, bonding technologies, best-in-class metrology, automated laser glass-processing, and optical design expertise.

Learn more about Corning Precision Glass Solutions here:

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About Corning Incorporated

Corning ( is one of the world's leading innovators in materials science, with a more than 165-year track record of life-changing inventions. Corning applies its unparalleled expertise in glass science, ceramic science, and optical physics along with its deep manufacturing and engineering capabilities to develop category-defining products that transform industries and enhance people's lives. Corning succeeds through sustained investment in RD&E, a unique combination of material and process innovation, and deep, trust-based relationships with customers who are global leaders in their industries.

Corning's capabilities are versatile and synergistic, which allows the company to evolve to meet changing market needs, while also helping our customers capture new opportunities in dynamic industries. Today, Corning's markets include optical communications, mobile consumer electronics, display technology, automotive, and life sciences vessels. Corning's industry-leading products include damage-resistant cover glass for mobile devices; precision glass for advanced displays; optical fiber, wireless technologies, and connectivity solutions for state-of-the-art communications networks; trusted products to accelerate drug discovery and delivery; and clean-air technologies for cars and trucks.