Corning, N.Y. – Corning Incorporated (NYSE:GLW) will showcase the next generation of fiber and cable solutions that increase the density, scalability, and performance of artificial intelligence (AI) networks at the 2025 Optical Fiber Communication Conference and Exposition.
What: Optical Fiber Communication Conference and Exposition
When: April 1-3
Where: Booth 1643, Moscone Center, San Francisco, CA
As generative AI demands grow, hyperscale data centers need high-density fiber, cable, and connectivity solutions that are scalable. Meanwhile, new regional data center hubs are emerging, and all need to be interconnected with fiber. Corning experts will demonstrate solutions that solve these challenges – from optimizing space in conduits and cable trays in the data center, to enabling high-bandwidth, low-latency links between cities and data center campuses.
“When operators build out their generative AI networks, they face challenges of density and scale – both inside and outside data centers. Corning is delivering the right innovations at the right time to help our customers meet these challenges,” said Michael O’Day, Senior Vice President and General Manager of Corning Optical Communications. “We’re applying our insights and technologies to support the growth of Gen AI networks and help connect the unconnected.”
Featured technologies in the booth include the recently launched Corning® GlassWorks AI™ solutions, a one-stop shop of customized data center products and services to help operators build the dense fiber infrastructure required for generative AI. This end-to-end portfolio provides industry-leading cable and connectivity solutions along with best-in-class network planning, design, and deployment support.
Corning experts will spotlight several solutions in the GlassWorks AI portfolio, including:
SMF-28® Contour fiber: A 40% smaller fiber compared to legacy fibers, with improved bend resilience for high-density environments. The booth will showcase the SMF-28 Contour fiber in a live demonstration.
Contour ™ Flow Cable: Corning’s latest high-density cable accelerates deployment of city-to-city interconnected networks for AI-enabled data centers. Contour Flow Cable, which contains SMF-28 Contour fiber, is engineered to maximize existing duct capacity by fitting double the amount of fiber into the same cable diameter.
A high-density MMC assembly: This compact MMC solution offers 16- and 24-fiber count configurations, thus facilitating scaled growth, space optimization, and accelerated build timelines – critical capabilities for data centers keeping pace with new AI applications.
In addition, Corning will provide several technical demonstrations of CPO technology:
CPO FlexConnect ™ fiber: A new single-mode, bend-resilient fiber optimized for short-length co-packaged optics (CPOs). This innovation significantly increases data processing capacity and streamlines connectivity to Graphical Processing Units and Central Processing Units, both of which are needed to facilitate high-bandwidth data center computations.
Two glass-based, detachable fiber-to-the-chip connector concepts: One with Ranovus’ ODIN® product and the other with GlobalFoundries’ GF Fotonix™ packaging test chip.
AI optical interconnect system: Mixx Technologies utilizes Corning’s optimized fiber management
An upgraded CPO concept: Corning’s switch layout featuring MMC connector assemblies.
The booth will also feature Corning’s newest broadband connectivity product, the RPX® Long Span cable. This technology is designed to accelerate rural deployments by providing longer aerial spans, simplified hardware, and fast mass-fusion splicing capability during installation.
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About Corning Incorporated
Corning (www.corning.com) is one of the world’s leading innovators in materials science, with a 170-year track record of life-changing inventions. Corning applies its unparalleled expertise in glass science, ceramic science, and optical physics along with its deep manufacturing and engineering capabilities to develop category-defining products that transform industries and enhance people’s lives. Corning succeeds through sustained investment in RD&E, a unique combination of material and process innovation, and deep, trust-based relationships with customers who are global leaders in their industries. Corning’s capabilities are versatile and synergistic, which allows the company to evolve to meet changing market needs, while also helping our customers capture new opportunities in dynamic industries. Today, Corning’s markets include optical communications, mobile consumer electronics, display, automotive, solar, semiconductors, and life sciences.
