Carrier Solutions

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Corning provides high precision glass carriers for temporary bonding in advanced semiconductor packaging processes such as silicon wafer thinning and fan-out level processing. Our ultra-flat glass carriers have superior surface quality, thickness, and edge strength, making them the substrate of choice for advanced packaging.

Corning's glass carriers are available in a wide range of CTEs to meet customers’ most challenging requirements – from research & development phase to mass production. We have an established global supply chain and have shipped hundreds of thousands of wafers to top-tier customers already.

Learn more about Corning Carrier Solutions below, including our two product categories: Standard Glass carriers and Advanced Packaging Carriers.

 

Product Information

PGS Carrier Wafers

Standard Glass Carriers

Standard Glass Carriers

Ultra-flat glass carriers available in CTEs from 3.4 - 9.5

Ultra-flat glass carriers available in CTEs from 3.4 - 9.5

PGS Carrier Wafer Flatness

Advanced Packaging Carriers

Advanced Packaging Carriers

Ultra-flat glass carriers designed to reduce customers' in-process warp by up to 40%. Rapid sampling enabled by Corning's Agile Manufacturing Platform.

Ultra-flat glass carriers designed to reduce customers' in-process warp by up to 40%. Rapid sampling enabled by Corning's Agile Manufacturing Platform.

Application Services

Application Services

PGS Application Services is designed to optimize customers’ use of glass, support pilot product development, and accelerate the ability to scale.

PGS Application Services is designed to optimize customers’ use of glass, support pilot product development, and accelerate the ability to scale.

In The News

Corning Discusses Ventures into Non-Display Markets

Corning Discusses Ventures in Non-Display Markets

2019년 1월 31일

“Corning Precision Glass Solutions has grown more than 30% over the past two years since it was founded,” said Rustom Desai, commercial director of Corning Precision Glass Solutions.

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PGS and SCH Provide Semiconductor Glass Carriers in China

PGS Provides Semiconductor Glass Carriers in China

2018년 11월 30일

CORNING, N.Y. — Corning Incorporated (NYSE: GLW) and SCH Electronics (Shanghai) Co. announced today they have signed a sales agency agreement focused on semiconductor glass carriers in China.

Read More