Semiconductor Materials and Laser Optics Capabilities | Glass Wafer Metrology and Fusion | Corning

We use cookies to ensure the best experience on our website.
View Cookie Policy
/emea/en/corning-cookie-policy.html
_self
Accept Cookie Policy
Change My Settings
ESSENTIAL COOKIES
Required for the site to function.
PREFERENCE AND ANALYTICS COOKIES
Augment your site experience.
SOCIAL AND MARKETING COOKIES
Lets Corning work with partners to enable social features and marketing messages.
ALWAYS ON
ON
OFF
Bright red laser beam shoots through optic component

Semiconductor Materials and Laser Optics Capabilities

Semiconductor Materials-Laser Optics Capabilities

Forming and Finishing

Forming capabilities include computer numerical control (CNC) machining and shaping of optics, specialized grinding equipment, diamond turning, and precision metal machining. Finishing capabilities include conventional polishing, proprietary super and deluxe polishing, magnetorheological finishing, and ion beam etching.

Coating
Corning specializes in high-end, ultra-precise coatings and offers a variety of over 200 proprietary coating designs covering the full spectrum from deep ultraviolet (DUV) to infrared (IR), wavelength-specific blocking coatings, protective coatings, and high-end transmissive coatings.

Optical Assembly
Corning delivers complete opto-mechanical sub-assemblies including design, materials, components, and optical sub-assemblies.

 

Additional Resources:
Bow, Warp, TTV: Definitions and Method of Measurement
Watch Corning's Fusion Process video