Corning provides high precision glass carriers for temporary bonding in advanced semiconductor packaging processes such as silicon wafer thinning and fan-out level processing. Our ultra-flat glass carriers have superior surface quality, thickness, and edge strength, making them the substrate of choice for advanced packaging.

Corning's glass carriers are available in a wide range of CTEs to meet customers’ most challenging requirements – from research & development phase to mass production. We have an established global supply chain and have shipped hundreds of thousands of wafers to top-tier customers already.

Learn more about Corning Carrier Solutions below, including our two product categories: Standard Glass carriers and Advanced Packaging Carriers.


Product Information

In The News

PGS and SCH Provide Semiconductor Glass Carriers in China


CORNING, N.Y. — Corning Incorporated (NYSE: GLW) and SCH Electronics (Shanghai) Co. announced today they have signed a sales agency agreement focused on semiconductor glass carriers in China.

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Precision Glass Solutions at Semicon Taiwan 2018

Precision Glass Solutions at Semicon Taiwan 2018


Corning Incorporated (NYSE: GLW) announced it will showcase an expanded range of precision glass solutions for emerging microelectronics applications Sept. 5–8 at Semicon Taiwan.

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