Semiconductor Materials
Semiconductor Materials and Laser Optics
Semiconductor Materials and Laser Optics
Corning’s Advanced Optics is a leading global supplier of optical materials and optics for the semiconductor industry.
Corning produces fluoride crystals and fused silica that are optimized for transmission and durability at the harshest laser and radiation exposure levels. Corning also specializes in shaping components, including flats, prisms, lenses, mirrors, and optics — with specialized surface figures. Cutting-edge technologies for finishing and coating are available for maximizing optic lifetime for highly transmissive, highly reflective, or partially reflective optics.
Our Products
Infrared (IR) Crystal Optics and Components
Infrared (IR) Crystal Optics and Components
Corning Specialty Materials offers high-quality refractive IR crystal optics and components.
Corning Specialty Materials offers high-quality refractive IR crystal optics and components.
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Directed Energy Windows
Directed Energy Windows
Corning's HPFS® 7980 Standard Grade Fused Silica is being used for windows in high-energy lasers that support Inertial Confinement Fusion (ICF) research.
Corning's HPFS® 7980 Standard Grade Fused Silica is being used for windows in high-energy lasers that support Inertial Confinement Fusion (ICF) research.
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Fluoride Crystals and Components
Fluoride Crystals and Components
Whether for lithography, vision correction, or industrial applications, excimer laser performance and “up time” are critically dependent on fluoride crystal quality.
Whether for lithography, vision correction, or industrial applications, excimer laser performance and “up time” are critically dependent on fluoride crystal quality.
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High Purity Fused Silica (HPFS®)
High Purity Fused Silica (HPFS®)
HPFS® Fused Silica glasses are known throughout the industry for their consistent, repeatable performance.
HPFS® Fused Silica glasses are known throughout the industry for their consistent, repeatable performance.
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Semiconductor Glass Wafers
Semiconductor Glass Wafers
Corning’s glass wafers offer attractive solutions for advanced semiconductor packaging applications such as carrier wafers for the silicon thinning process in temporary bonding.
Corning’s glass wafers offer attractive solutions for advanced semiconductor packaging applications such as carrier wafers for the silicon thinning process in temporary bonding.
Ultra-Low Expansion (ULE®) Glass
Ultra-Low Expansion (ULE®) Glass
ULE® is a titania-silicate glass with near zero expansion that makes it the material of choice in many applications.
ULE® is a titania-silicate glass with near zero expansion that makes it the material of choice in many applications.
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Opto-Mechanical Assemblies
Opto-Mechanical Assemblies
Corning designs and fabricates modules and assemblies to meet our customers' demanding performance requirements.
Corning designs and fabricates modules and assemblies to meet our customers' demanding performance requirements.
Learn MoreCapabilities
Forming capabilities include computer numerical control (CNC) machining and shaping of optics, specialized grinding equipment, diamond turning, and precision metal machining. Finishing capabilities include conventional polishing, proprietary super and deluxe polishing, magnetorheological finishing, and ion beam etching.
Resources
Resources
Corning has all the resources you need, including product information sheets, white papers, technical, technical specifications, and videos.