Semiconductor Materials and Laser Optics Capabilities | Advanced Optics |

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Bright red laser beam shoots through optic component

Semiconductor Materials and Laser Optics Capabilities

Semiconductor Materials-Laser Optics Capabilities

Forming and Finishing

Forming capabilities include computer numerical control (CNC) machining and shaping of optics, specialized grinding equipment, diamond turning, and precision metal machining. Finishing capabilities include conventional polishing, proprietary super and deluxe polishing, magnetorheological finishing, and ion beam etching.

Corning specializes in high-end, ultra-precise coatings and offers a variety of over 200 proprietary coating designs covering the full spectrum from deep ultraviolet (DUV) to infrared (IR), wavelength-specific blocking coatings, protective coatings, and high-end transmissive coatings.

Optical Assembly
Corning delivers complete opto-mechanical sub-assemblies including design, materials, components, and optical sub-assemblies.

Semiconductor Glass Wafers: Metrology

As wafer diameters increase and specifications become tighter, proper measurement equipment capable of accurately measuring flatness, thickness, and thickness uniformity is critical for successful integration of 3DS-IC assemblies.

Conventional mounting methods, such as three/four-point mounts, are less suitable for flatness characterization of such high aspect ratio parts due to a great deal of deflection of gravity and sensitivity to how the wafer is placed on the mount. This leads to erroneous results when trying to characterize warp and bow.

Corning, a world leader in advanced precision measurement system, has designed and developed metrology instruments specifically designed to meet semiconductor wafer standard requirements.

Learn more about Tropel® Metrology Instruments.

Additional Resources: 
Bow, Warp, TTV: Definitions and Method of Measurement

Semiconductor Glass Wafers: Fusion Process

Corning’s proprietary fusion manufacturing process is at the core of our leadership in glass technology. This extraordinarily precise, highly automated draw process produces glass wafers with exceptionally clean, smooth, flat surfaces, and inherent dimensional stability with low TTV and warp – qualities crucial for a carrier wafer for thinning semiconductor wafers.

Corning’s fusion manufacturing process offers critical advantages for the semiconductor industry, including:

  • Exceptional flatness with excellent thickness control. Wafer flatness and low TTV is particularly critical in the thinning of silicon wafers. Any deviations from flatness can result in distortions. With Corning’s proprietary fusion process, the glass is formed in air and drawn down to form an incredibly flat piece of glass with very precise thickness controls.
  • Pristine surface quality and scalability. Because glass formed using this method requires no subsequent surface grinding or polishing, fusion is an optimal technology for producing high-quality glass wafers. To maintain this quality from start to finish, Corning has entirely mechanized the substrate handling processes. The end result enables us to supply cost-effective wafers, with a variety of glass wafer sizes and specifications, to the industry.

Additional Resources:
Watch Corning's Fusion Process video