Corning® CellBIND® 表面 | 带负电荷的先进组织培养表面 | 康宁

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CellBIND表面

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康宁CellBIND表面

康宁CellBIND表面

通过增加聚合物表面的氧含量,增强亲水性和润湿性,从而提高细胞伸展和粘附,促进细胞贴壁。

Corning CellBIND Surface: An Improved Surface for Enhanced Cell Attachment

通过增加聚合物表面的氧含量,增强亲水性和润湿性,从而提高细胞伸展和粘附,促进细胞贴壁。

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对HEK 293细胞的协同作用

对HEK 293细胞的协同作用

了解使用康宁CellBIND表面和无血清培养基进行贴壁培养的优点。

了解使用康宁CellBIND表面和无血清培养基进行贴壁培养的优点。

Benefits of Using CellBIND for Culturing HEK 293 Cells:

• Under these serum-free conditions, HEK 293 cells maintain a more normal/flattened adherent morphology on the Corning CellBIND Surface versus a standard Tissue Culture-treated surface
• The improved adherence of HEK cells on the Corning CellBIND Surface results in 69% more cells at 96 hours as compared to cells grown on standard tissue culture treated surfaces
• The Corning CellBIND Surface yields a greater number of total cells (adherent and nonadherent) during the time course of the study
 

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利用康宁CellBIND表面提高细胞生长速度和产量

利用康宁CellBIND表面提高细胞生长速度和产量

在艰难条件下提高贴壁细胞培养(如:减血清或无血清培养培养基)

利用康宁CellBIND表面提高细胞生长速度和产量

从优势、质量标准到应用信息,了解康宁CellBIND表面如何提高细胞粘附率。

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