Process Solution for Glass Wafer Dicing
For over 170 years, Corning has applied its unparalleled expertise in glass science, ceramic science, and optical physics. Now, Corning Laser Technologies (CLT) is leveraging 20-plus years of experience in precision laser machining with Dynatex International’s 60 years expertise in die singulation.
The CLT 400S-WD has been developed to provide a new laser dicing solution for the Semiconductor industry with a compact footprint and high precision stages. By uniting the innovative laser process with the StreetSmart breaking technology, we offer an industry-leading Glass-Wafer Dicing Solution to yield superior throughput, enable unprecedented aspect ratios and a die quality that meets highest demands.
Corning Laser Technologies’ patented nanoPerforation technology provides a modification trace through the entire thickness up to multiple millimeters of glass in a single pass. Glass wafers with a diameter of up to 300 mm and glass panels of up to 400 mm can be processed.
The subsequent breaking process with the “Dynatex DTX-200 by CLT” enables high-quality die separation.