Dynatex DTX-200 by CLT for Scribe & Break
Dynatex International has a 60-year history in die singulation. Designed for optimal speed in dicing narrow streets on III-V substrates (like InP or GaAs) and hard materials, dry-process dicing is the optimal solution for high-yield manufacturing. With a fast, user-friendly interface and fully automated processing, the process reduces downtime and human intervention. The precision diamond scribe tool processes 3-5 microns of a 20-micron street, allowing more die-per-wafer, which is efficient and economical. The breaking method enables a precise means of die separation with minimal debris, ensuring better quality cuts and a higher overall device yield.
- Si-Photonics III-V chips
- Laser Diode Cleaving and Matrix Bar-to-Die separation
- OptoElectronics Devices (PhotoDiodes, Modulators, etc.)
- MEMS and BioMedical devices with sensitive structures/coatings
- LED separation (typically Break Only application)
CLT nanoPerforation & Dynatex DTX-200 by CLT mechanical break
For applications involving glass, the unique combination of Corning Laser Technologies’ nanoPerforation process (e.g., with a CLT 400S-WD) paired with mechanical breaking by a Dynatex DTX-200 expands the processing capabilities.
Examples of new capabilities include:
- Dies in sub-mm size
- Heat-sensitive coatings
- Glasses with low CTE
The separation is typically followed by a tape expand step, for which we offer the Dynatex DXE 5 & 9 Series Wafer Expander by CLT.