Corning and Intel Collaborate on Next-Generation Silicon Photonics Connectivity

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Corning and Intel Collaborate on Next-Generation Silicon Photonics Connectivity

Corning and Intel Collaborate on Next-Generation S

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Optical Communications
Corning and Intel Collaborate on Next-Generation Silicon Photonics Connectivity
Corning and Intel Collaborate on Next-Generation Silicon Photonics Connectivity
CORNING, N.Y. | Corning Incorporated | 2013年9月4日
New multimode fiber and connector supports 25G for upcoming Intel® Rack Scale architecture 

Corning Incorporated (NYSE:GLW) introduces a new fiber and connector technology developed for Intel® Corporation to support its upcoming Intel Silicon Photonics Technology® products.

Intel challenged Corning to design optical connectivity solutions to enable Intel Silicon Photonics Technology (SPT) products in development. The resulting combination of the Intel and Corning technologies is expected to help send massive amounts of data - up to 1.6 terabits per second - at lengths up to 300 meters into and around servers in data centers, helping speed the industry’s transition to cloud computing, big data and rack-scale architectures.

“Our upcoming products require connectivity technology that complements the high speed and advanced capabilities of silicon photonics, and that is also tailored for the specific needs of data centers,” said Mario Paniccia, Intel fellow and general manager, Silicon Photonics operation.  “As a world leader in fiber technology, Corning is uniquely qualified to be the first to deliver these capabilities.”

Corning analyzed Intel’s technology requirements and developed Corning® ClearCurve® LX Multimode Fiber, designed to enable 25G transmission at 1310 nm, the wavelength used in silicon photonic systems, and capable of the tight bends within and around data center components. In addition, Corning developed the MXC Connector, which provides up to 64-fiber connectivity in a smaller footprint and at a lower cost than most traditional multi-fiber connectors. When configured with 64 fibers, this solution is designed to deliver data rates up to 1.6 terabits per second.

“We relish the opportunity to develop innovative solutions that solve tough problems for our customers,” said Clark Kinlin, executive vice president, Corning Telecommunications Business Group. “Intel is leading the way in silicon photonics, and we’re proud to provide the optical connectivity solutions that enable Intel’s technology for next-generation data centers.”

Corning has developmental samples of ClearCurve LX Multimode Fiber now. Corning will offer the fiber and the MXC Connector as a complete product, called the Pretium EDGE® SiPh Cable Assembly, when Intel Silicon Photonics components are available.

For additional information on Corning fiber optic products and services, contact a customer care representative at 1-800-743-2675, toll free in the United States; or (+1) 828-901-5000, international; or visit For more information on ClearCurve® LX Multimode Fiber, contact 1-607-974-9000.

Intel® and Silicon Photonics Technology® are trademarks of Intel Corporation.

Forward-Looking and Cautionary Statements
This press release contains “forward-looking statements” (within the meaning of the Private Securities Litigation Reform Act of 1995), which are based on current expectations and assumptions about Corning’s financial results and business operations, that involve substantial risks and uncertainties that could cause actual results to differ materially. These risks and uncertainties include: the effect of global political, economic and business conditions; conditions in the financial and credit markets; currency fluctuations; tax rates; product demand and industry capacity; competition; reliance on a concentrated customer base; manufacturing efficiencies; cost reductions; availability of critical components and materials; new product commercialization; pricing fluctuations and changes in the mix of sales between premium and non-premium products; new plant start-up or restructuring costs; possible disruption in commercial activities due to terrorist activity, armed conflict, political or financial instability, natural disasters, adverse weather conditions, or major health concerns; adequacy of insurance; equity company activities; acquisition and divestiture activities; the level of excess or obsolete inventory; the rate of technology change; the ability to enforce patents; product and components performance issues; retention of key personnel; stock price fluctuations; and adverse litigation or regulatory developments. These and other risk factors are detailed in Corning’s filings with the Securities and Exchange Commission. Forward-looking statements speak only as of the day that they are made, and Corning undertakes no obligation to update them in light of new information or future events.

About Corning Incorporated
Corning Incorporated ( is the world leader in specialty glass and ceramics.  Drawing on more than 160 years of materials science and process engineering knowledge, Corning creates and makes keystone components that enable high-technology systems for consumer electronics, mobile emissions control, telecommunications and life sciences. Or products include glass substrates for LCD televisions, computer monitors and laptops; ceramic substrates and filters for mobile emission control systems; optical fiber, cable, hardware & equipment for telecommunications networks; optical biosensors for drug discovery; and other advanced optics and specialty glass solutions for a number of industries including semiconductor, aerospace, defense, astronomy and metrology.