- Products visión de conjunto
- Aerospace and Defense
- Analytic Instruments
- Fibrance Light-Diffusing Fiber
- Laser Technologies
- Medical Optics
- Precision and Inspection Optics
- Semiconductor Materials and Laser Optics
- Specialty Fiber and Glass Polarizers
- Specialty Glass and Glass Ceramics
- Spectral Imaging
- Thin Glass
Tropel FlatMaster analyzes the entire surface of parts in seconds, regardless of its size or complexity. FlatMaster MSP can measure parts up to 300 mm diameter, on a variety of materials and surface finishes.
Tropel® FlatMaster® System
The Tropel® FlatMaster® provides industry-leading performance of surface form measurements for precision-component manufacturers. Our non-contact optical technique records the entire surface in seconds.
The FlatMaster® offers five-nanometer resolution and a standard accuracy of 50 nanometers (2.0 µ"). It rapidly and accurately measures flatness, line profile, radius, and other surface parameters from a variety of surfaces.
Several standard versions of the FlatMaster® are available to optimize accuracy over different component size ranges. The FlatMaster® 40, 100, and 200 measures parts up to 40 mm, 100 mm, and 200 mm respectively.
Customizing is available to achieve your specific performance requirements whether it is for increasing dynamic range, accuracy, or to include component handling features.
Tropel® FlatMaster® MSP
The Tropel® FlatMaster® MSP (Multi-Surface Profiler) is a frequency stepping interferometer that provides fast and accurate metrology for semiconductor wafers up to 300mm in diameter. In seconds up to 3 million data points are collected with sub-micron accuracy enabling total thickness and flatness characterization over the entire surface.
The FlatMaster MSP provides robust metrology for a variety of applications from complex components and assemblies to transparent materials and wafer metrology. The FlatMaster MSP-DH is configured to simultaneously measure two sides of a component or assembly providing absolute thickness and parallelism measurements.
The ability to measure flatness, thickness, and thickness variation of 300 millimeter glass and silicon wafers is critical for successful integration of 3DIC assemblies. Traditional contact probes or conventional interferometry systems are too slow or do not have the necessary accuracy for larger fields of view.