Precision Glass Solutions | Augmented Reality (AR) Glass Wafer, HPFS Fused Silica Wafer, and Carrier Wafer Solutions | Corning

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Precision wafers and panels enabling high performance
in consumer electronics and the Internet of Things

Corning Precision Glass Solutions offers high-precision wafer and panel format glass-based solutions, enabling higher speeds, lower form factors and enhanced optical performance in a variety of applications, including consumer electronics and the Internet of Things.

The inherent properties of glass – high optical transmission, excellent electrical performance, tight geometrical tolerances, and pristine surface quality – along with Corning’s ability to offer different compositions, shapes and form factors, position glass as the premier material for next-generation semiconductor packaging.

Backed by Corning’s over 150 years of glass and material science expertise, our unique capabilities in Surface Treatments, Material Deposition, Precision Cutting, Data Analytics and Reliable Supply help solve our customers’ toughest technology challenges.

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Enabling Technologies

Key Supporting Platforms