Corning Optical Communications Introduces Innovative Fiber-to-the-Antenna Wireless Solutions

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Corning Optical Communications Introduces Innovative Fiber-to-the-Antenna Wireless Solutions

Corning Optical Communications Introduces Innovati

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Optical Communications
Corning Optical Communications Introduces Innovative Fiber-to-the-Antenna Wireless Solutions
Corning Optical Communications Introduces Innovative Fiber-to-the-Antenna Wireless Solutions
HICKORY, N.C. | Corning Incorporated | 2011年9月8日

Corning Optical Communications LLC, part of Corning Incorporated’s (NYSE:GLW) Telecommunications segment, introduces its preterminated Evolant® Solutions for Wireless Networks. Based on fiber-fed remote radio technology, the field-proven fiber-to-the-antenna (FTTA) solutions enable fast plug-and-play deployments that can save time and money.

Today’s wireless operators face ongoing challenges to supply the coverage and capacity customers want, especially for data. The deployment of 3G and 4G solutions often occurs in crowded tower and rooftop environments. Fiber-fed remote radio technology offers potential savings to both capital expenditures and operating expenses, compared to traditional coaxial cable-based solutions, by reducing installation time and the number and size of components installed in these crowded environments.

The most basic way to connect remote radios (or units) to their base transceiver station (BTS) is to homerun optical and power cables from each remote radio to the BTS. However, wireless operators concerned with adding future remote radios and making easy repairs and upgrades can benefit from a terminal-based solution. This approach places an optical terminal at the tower or rooftop to which short jumpers can be connected to each remote radio. A single optical cable runs from the terminal to the base station, reducing the size and number of components and lease costs.

Wireless backhaul with fiber to the cell site, tower or rooftop is a common deployment method to ensure the cell site has the broadband connectivity required for 3G and 4G networks. Corning’s solutions enable state-of-the-art fiber management and reliable, fast connectivity.

These unique products support Corning’s wireless technology:

• OptiSheath® MF2 MultiPort Terminal, which is placed at the top of the tower or on the rooftop to form the foundation of the solution.
• Remote Radio Fiber Optic Cable Assembly, a preconnectorized assembly with a connector for the radio interface on one end and the terminal on the other.
• Remote Radio Distribution Terminal, which combines optical and power connectivity into one terminal.
• Wireless Consolidation Terminal, which allows wireless backhaul providers to easily manage fiber drops to base station equipment at the cell site.
• Cell Site Drop Assembly, which is a preconnectorized cable assembly that makes that final link from the demarcation cabinet to an individual operator.

Corning will highlight these wireless deployment solutions through exhibits and hands-on demonstrations at the OSP EXPO®, Sept. 12-14 in Cincinnati, Ohio.

For additional information on Corning Optical Communications products and services, contact a customer service representative at 1-800-743-2675, toll free in the United States, or (+1) 828-901-5000, international, or visit the Web site at www.corning.com/opcomm.

About Corning Incorporated
Corning Incorporated (www.corning.com) is the world leader in specialty glass and ceramics.  Drawing on more than 160 years of materials science and process engineering knowledge, Corning creates and makes keystone components that enable high-technology systems for consumer electronics, mobile emissions control, telecommunications and life sciences. Our products include glass substrates for LCD televisions, computer monitors and laptops; ceramic substrates and filters for mobile emission control systems; optical fiber, cable, hardware & equipment for telecommunications networks; optical biosensors for drug discovery; and other advanced optics and specialty glass solutions for a number of industries including semiconductor, aerospace, defense, astronomy and metrology.