Corning Optical Communications LLC, part of Corning Incorporated’s (NYSE:GLW) Telecommunications segment, will debut Optical Cables by Corning to the European market at CeBIT 2013 in Hannover, Germany, March 5-9.
Optical Cables by Corning are designed to bring the benefits of optical fiber to the consumer market for the two fastest computer and peripheral connectivity protocols -- Thunderbolt™ and USB 3.0. The new cables extend the data transmission range past the length limits of copper-based cables. Optical Cables by Corning are approximately 50 percent smaller and up to 80 percent lighter than comparable copper cables, while also substantially increasing strength and flexibility.
“Copper connectivity has reached its length limits, and consumers are demanding longer cables that better fit their bandwidth usage, lifestyle, and space,” said Bernhard Deutsch, vice president, Consumer Networks Connectivity Solutions for Corning Optical Communications.
“Corning wanted to free consumers from the current length barriers for Thunderbolt™ and USB connectivity, while providing an innovative way to create, move and manage their data in a much more flexible, efficient and durable way. With Optical Cables by Corning, consumers can now live-edit video from across the length of a football pitch; download a music library up to 40 percent faster; and quickly access and connect devices to bandwidth- intensive applications with these much smaller and lighter cables,” Deutsch said.
USB 3.Optical Cables by Corning can reach lengths of up to 30 meters, and Thunderbolt Optical Cables by Corning can reach lengths up to 100 meters, the approximate length of a soccer field. The light weight and flexibility of the cables also make them easy to route in workspaces and convenient to pack and transport. The unique cable design and Corning® ClearCurve® VSDN® optical fiber allow the glass-based Optical Cables by Corning to be as durable as comparable copper cables.
The Optical Thunderbolt Cables provide a dual channel, bidirectional 10 Gb/s data rate with data and video on a single cable, allowing the transfer of a full HD movie in fewer than 30 seconds. The ultra-slim “zero-bend” radius cable has an electrically isolated noise-reducing design, can “daisy-chain” up to six Thunderbolt devices at the same time and is “hot swappable,” meaning it can be attached and removed without interruption to the system.
The USB 3.Optical Cables provide a 5 Gb/s data transfer rate and are compatible with USB 3.0 and USB 2.0 devices*, allowing the extension of USB device reach without additional power supply. The ultra-slim, “zero-bend” radius cable has a built-in overcurrent protection and is also hot swappable.
At CeBIT, attendees will be able to view live demonstrations related to the speed, flexibility and durability of Optical Cables by Corning. These will be held at the Corning Stand, #G42, located in Hall 17, March 5-9.
Optical Cables by Corning are targeted to be available for sale through select North American consumer electronic retail channels in the second quarter of this year. They are slated to be available worldwide later in 2013, and Corning is currently investigating potential distributors for expansion into Europe, as well as other geographies.
For additional information on Optical Cables by Corning, visit the websiteOpticalCablesByCorning.com.
*This cable is designed to be compatible with devices using USB 3.0 and 2.0 interfaces. However, the USB-IF has not yet developed a specification for optical fiber transmission.
Thunderbolt is a trademark of Intel Corporation in the U.S. and/or other countries.
Forward-Looking and Cautionary Statements
This press release contains “forward-looking statements” (within the meaning of the Private Securities Litigation Reform Act of 1995), which are based on current expectations and assumptions about Corning’s financial results and business operations, that involve substantial risks and uncertainties that could cause actual results to differ materially. These risks and uncertainties include: the effect of global political, economic and business conditions; conditions in the financial and credit markets; currency fluctuations; tax rates; product demand and industry capacity; competition; reliance on a concentrated customer base; manufacturing efficiencies; cost reductions; availability of critical components and materials; new product commercialization; pricing fluctuations and changes in the mix of sales between premium and non-premium products; new plant start-up or restructuring costs; possible disruption in commercial activities due to terrorist activity, armed conflict, political or financial instability, natural disasters, adverse weather conditions, or major health concerns; adequacy of insurance; equity company activities; acquisition and divestiture activities; the level of excess or obsolete inventory; the rate of technology change; the ability to enforce patents; product and components performance issues; retention of key personnel; stock price fluctuations; and adverse litigation or regulatory developments. These and other risk factors are detailed in Corning’s filings with the Securities and Exchange Commission. Forward-looking statements speak only as of the day that they are made, and Corning undertakes no obligation to update them in light of new information or future events.
About Corning Incorporated
Corning Incorporated (www.corning.com) is the world leader in specialty glass and ceramics. Drawing on more than 160 years of materials science and process engineering knowledge, Corning creates and makes keystone components that enable high-technology systems for consumer electronics, mobile emissions control, telecommunications and life sciences. Our products include glass substrates for LCD televisions, computer monitors and laptops; ceramic substrates and filters for mobile emission control systems; optical fiber, cable, hardware & equipment for telecommunications networks; optical biosensors for drug discovery; and other advanced optics and specialty glass solutions for a number of industries including semiconductor, aerospace, defense, astronomy, and metrology.