We use cookies to ensure the best experience on our website.
View Cookie Policy
_self
Accept Cookie Policy
Change My Settings
ESSENTIAL COOKIES
Required for the site to function.
PREFERENCE AND ANALYTICS COOKIES
Augment your site experience.
SOCIAL AND MARKETING COOKIES
Lets Corning work with partners to enable social features and marketing messages.
ALWAYS ON
ON
OFF

Corning provides high precision glass carriers for temporary bonding in advanced semiconductor packaging processes such as silicon wafer thinning and fan-out level processing. Our ultra-flat glass carriers have superior surface quality, thickness, and edge strength, making them the substrate of choice for advanced packaging.

Corning's glass carriers are available in a wide range of CTEs to meet customers’ most challenging requirements – from research & development phase to mass production. We have an established global supply chain and have shipped hundreds of thousands of wafers to top-tier customers already.

Learn more about Corning Carrier Solutions below, including our two product categories: Standard Glass carriers and Advanced Packaging Carriers.

 

Product Information

In The News

PGS and SCH Provide Semiconductor Glass Carriers in China

2018年11月30日

CORNING, N.Y. — Corning Incorporated (NYSE: GLW) and SCH Electronics (Shanghai) Co. announced today they have signed a sales agency agreement focused on semiconductor glass carriers in China.

Read More

Precision Glass Solutions at Semicon Taiwan 2018

Precision Glass Solutions at Semicon Taiwan 2018

2018年9月4日

Corning Incorporated (NYSE: GLW) announced it will showcase an expanded range of precision glass solutions for emerging microelectronics applications Sept. 5–8 at Semicon Taiwan.

Read More