Corning Launches Optical Cable Assemblies Built for 21st Century Data Centers

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Corning Launches Optical Cable Assemblies Built for 21st Century Data Centers

Corning Launches Optical Cable Assemblies Built fo

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Optical Communications
Corning Launches Optical Cable Assemblies Built for 21st Century Data Centers
Corning Launches Optical Cable Assemblies Built for 21st Century Data Centers
CORNING, N.Y. | Corning Incorporated | March 10, 2014

Corning Incorporated (NYSE:GLW) today announced the availability of its high-speed MXC™ optical cable assembly to support Intel® Silicon Photonics. Intel’s breakthrough technology delivers unprecedented performance and energy efficiency within the data center. Corning’s innovative cabling solution is capable of sending up to 1.6 terabits per second of data at distances of up to 300 meters.

Every day, 2.5 quintillion bytes of data are created with 90 percent of the world’s data created in the last two years alone. To support this tremendous surge in traffic, next-generation data centers will require full-optical connectivity – not just in the backbone and cross connects deployed in today’s data centers – but all the way to server ports which typically use copper, resulting in slower downlinks.

Using an MXC optical connector and Corning® ClearCurve® LX fiber, the optical cable assembly can transfer massive amounts of data up to 2.5 times faster than standard 10G Ethernet connections. In addition to unparalleled data capacity and fiber reach, ClearCurve LX fibers have one-fifth the bend radius when compared to standard fibers sold today, making them more flexible for routing through crowded server-switch-storage racks. 

“Corning has a long history of developing innovative fiber optic technology and we are excited about this launch,” said Clark Kinlin, executive vice president of Corning’s Optical Communications business. “We look forward to continuing our collaboration with Intel and other industry leaders to create high-speed, low-power, and cost-effective optical technologies that will have a transformative impact on cloud computing, big data and other applications that require robust data center technologies.”  

Intel Silicon Photonics devices are designed to be low-cost, fast, scalable and energy-efficient, providing extremely high bandwidth over longer distances than conventional electrical or optical solutions. The flexibility of Intel Silicon Photonics should enable data center designers to be more creative in how they architect the data center since they will no longer be encumbered by obstacles such as the distance between servers. Intel Silicon Photonics will also be used in traditional applications, such as Ethernet, top-of-rack connectivity, high performance computing, and storage. The introduction of the MXC cable assembly will help drive the commercial availability of Silicon Photonics.

“The MXC cable assembly is a great example of how collaboration can help drive the technology needed for future data centers,” said Dr. Mario Paniccia, Intel Fellow and general manager of the Silicon Photonics Solutions group. “We look forward to continuing our collaboration with Corning and with our other partners to bring it to the industry.”

Forward-Looking and Cautionary Statements 
This press release contains "forward-looking statements" (within the meaning of the Private Securities Litigation Reform Act of 1995), which are based on current expectations and assumptions about Corning's financial results and business operations, that involve substantial risks and uncertainties that could cause actual results to differ materially. These risks and uncertainties include: the effect of global political, economic and business conditions; conditions in the financial and credit markets; currency fluctuations; tax rates; product demand and industry capacity; competition; reliance on a concentrated customer base; manufacturing efficiencies; cost reductions; availability of critical components and materials; new product commercialization; pricing fluctuations and changes in the mix of sales between premium and non-premium products; new plant start-up or restructuring costs; possible disruption in commercial activities due to terrorist activity, armed conflict, political or financial instability, natural disasters, adverse weather conditions, or major health concerns; adequacy of insurance; equity company activities; acquisition and divestiture activities; the level of excess or obsolete inventory; the rate of technology change; the ability to enforce patents; product and components performance issues; retention of key personnel; stock price fluctuations; and adverse litigation or regulatory developments. These and other risk factors are detailed in Corning's filings with the Securities and Exchange Commission. Forward-looking statements speak only as of the day that they are made, and Corning undertakes no obligation to update them in light of new information or future events.

About Corning Incorporated
Corning Incorporated ( is the world leader in specialty glass and ceramics. Drawing on more than 160 years of materials science and process engineering knowledge, Corning creates and makes keystone components that enable high-technology systems for consumer electronics, mobile emissions control, telecommunications and life sciences. Our products include glass substrates for LCD televisions, computer monitors and laptops; ceramic substrates and filters for mobile emission control systems; optical fiber, cable, hardware & equipment for telecommunications networks; optical biosensors for drug discovery; and other advanced optics and specialty glass solutions for a number of industries including semiconductor, aerospace, defense, astronomy, and metrology.