Carrier Solutions

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Corning provides high precision glass carriers for temporary bonding in advanced semiconductor packaging processes such as silicon wafer thinning and fan-out level processing. Our ultra-flat glass carriers have superior surface quality, thickness, and edge strength, making them the substrate of choice for advanced packaging.

Corning's glass carriers are available in a wide range of CTEs to meet customers’ most challenging requirements – from research & development phase to mass production. We have an established global supply chain and have shipped hundreds of thousands of wafers to top-tier customers already.

Learn more about Corning Carrier Solutions below, including our two product categories: Standard Glass carriers and Advanced Packaging Carriers.

 

Product Information

In The News

Corning Discusses Ventures into Non-Display Markets

Corning Discusses Ventures in Non-Display Markets

31-Jan-2019

“Corning Precision Glass Solutions has grown more than 30% over the past two years since it was founded,” said Rustom Desai, commercial director of Corning Precision Glass Solutions.

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PGS and SCH Provide Semiconductor Glass Carriers in China

PGS Provides Semiconductor Glass Carriers in China

30-Nov-2018

CORNING, N.Y. — Corning Incorporated (NYSE: GLW) and SCH Electronics (Shanghai) Co. announced today they have signed a sales agency agreement focused on semiconductor glass carriers in China.

Read More