The continued demand for higher-density chips with smaller critical dimensions leads to tighter substrate form tolerances both on the global scale and on the individual die-site scale. Corning Tropel has optimized our patented grazing-incidence interferometry technology for the highest-precision wafer flatness measurements.
The FlatMaster Wafer System is ideal for processes development, particularly for new, non-silicon materials.
From wire saw to finished wafer, you can quickly and accurately measure wafer flatness to verify that you or your customers have the ability to achieve the required device yields.
The FlatMaster Wafer system measures flatness, taper, thickness variation, thickness, stress, bow, warp, SORI, and many other parameters including stepper simulation of any wafer surface.
Industry standard chucks are easy to load and are non-damaging to wafers.
Combined with our state-of-the-art optical fabrication techniques and Tropel's renowned phase-shifting analysis software, the FlatMaster Wafer system offers full-form surface information with 50 nanometer accuracy in seconds.
Additional Information:
FlatMaster Wafer System Product Information Sheet
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