IR Crystal Optics and Components
Directed Energy Windows
Fluoride Crystals
HPFS Fused Silica
Semiconductor Glass Wafers
ULE Low Expansion Glass
Opto Mechanical Assemblies

Corning Semiconductor Glass Wafers

Corning’s glass wafers offer attractive solutions for advanced semiconductor packaging applications such as carrier wafers for the silicon thinning process in temporary bonding.

Our propriety fusion process delivers pristine surface quality with exceptionally low total thickness variation (TTV) and low warp (flatness) without the need for polishing.

Manufactured using an Alkaline Earth Boro-Aluminosilicate material, Corning’s glass wafers are alkali free, reusable, and environmentally friendly. Learn more about Corning’s glass wafers.

Additional Information:

> Corning® Semiconductor Glass Wafer Product Information Sheet

> Applications

> Benefits

> Technical Resources 

Please contact us at semiglass@corning.com for more information or placing an order.