Corning’s glass wafers offer attractive solutions for advanced semiconductor packaging applications such as carrier wafers for the silicon thinning process in temporary bonding.
Our propriety fusion process delivers pristine surface quality with exceptionally low total thickness variation (TTV) and low warp (flatness) without the need for polishing.
Manufactured using an Alkaline Earth Boro-Aluminosilicate material, Corning’s glass wafers are alkali free, reusable, and environmentally friendly. Learn more about Corning’s glass wafers.
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