Corning Gilbert created innovative packaging solutions for its high-performance interconnect systems by integrating the interfaces of its sub-minature, push-on interconnects into Multiposition Blocks. Regardless of interface type, our Multiposition Blocks enable increased connection density — resulting in an overall smaller footprint — without sacrificing RF performance.
> GPPO® Multiposition Block Series Product Info > G3POTM Multiposition Block Series Product Info For additional information on all our multiposition block products, please reference each product family pages in the Microwave Push-on Interconnects Catalog.