Core-to-Core Alignment, Three-Axis Splicers


STE_OS_LID
OptiSpliceTM LID 

The top of the line fully featured OptiSpliceTM LID with no compromise in performance ensures high splicing throughput combined with best possible splice quality and state-of-the-art user interface:

  • 5.7 inch colour TFT touchscreen with QVGA resolution
  • Splice loss single-mode typically <0.02dB
  • High precision core-to-core alignment with LID system incl. fast CDS as alternative method
  • Live process control with Corning proprietary Automatic Fusion time Control (AFCTM) that remains functioning while working in CDS mode with compatible fibers
  • Real splice loss measurement through the LID system with unbeatable ±0.02dB accuracy
  • Integrated GPS module for location information and automatic altitude compensation
  • Long-life stabilized P&D electrodes
  • High capacity Li-Ion battery for minimum 130 splices including the use of the heatshrink oven
  • MMC card slot with built-in training videos
  • PC connectivity though USB port for software upgrade and splice data download
  • Detachable splice tray holder as screen protector

 STE_OS_CDS
OptiSpliceTM CDS

The alternative OptiSpliceTM CDS offers the fast CDS core alignment method for best price performance ratio:

  • 5.7 inch colour TFT touchscreen with QVGA resolution
  • Splice loss single-mode typically <0.02dB
  • Fast-and-accurate core-to-core alignment with CDS system
  • Fixed splice time with current optimization through CDS system
  • Splice loss estimation through L-PAS™ video-evaluation system
  • Integrated GPS module for location information and automatic altitude compensation
  • Long-life stabilized P&D electrodes
  • High capacity Li-Ion battery for minimum 130 splices including the use of the heatshrink oven
  • MMC card slot with built-in training videos
  • PC connectivity though USB port for software upgrade and splice data download
  • Detachable splice tray holder as screen protector


Product Specification:
> OptiSplice LID and CDS datasheet


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